High Leveling Bright Acid Copper Brightener 22020
Description:
| Lead Time | 10 - 15 days |
Quick Details
| High Leveling | Smooth Coating | Bright Finish | Glossy Appearance |
| Improved Adhesion | Strong Bonding | Corrosion Resistance | Oxidation Protection |
| Wide Industry Application | Versatile Use |
Product Details
Introduction:
1. High speed bright acid copper plating process with advanced formulation.
2. Tolerance to work at higher temperature.
3. Fast plating speed to obtain uniform brightness and leveling on HCD to LCD.
4. Smooth and ductile deposit without pitting or pinholes, can create very good
corrosion resistance with other metals plated on top.
5. Commonly suitable for any size especially polished metal parts.
Operating Parameters
| Chemical Content | Working Range | Optimum |
| Copper Sulphate | 200 ~ 220 g/L | 210 g/L |
| Sulphuric Acid | 50 ~ 90 g/L | 75 g/L |
| Chloride Ion | 80 ~ 120 ppm | 90 ppm |
| 22022 MU Makeup Additive | 6.0 ~ 10 ml/L | 8.0 ml/L |
| 22022 A Brightener | 0.4 ~ 0.6 ml/L | 0.5 ml/L |
| 22022 B Leveler | 0.4 ~ 0.6 ml/L | 0.5 ml/L |
| Cathode Current Density | 1 ~ 6 A/dm² | |
| Anode Current Density | 0.5 ~ 3 A/dm² | |
| Temperature | 20 ~ 35 ˚C | 25 ˚C |
| Agitation | Vigorous even compressed air agitation | |
| Anodes | Phosphorous copper in titanium baskets with nylon bags | |
