High Leveling Bright Acid Copper Brightener 22019
Description:
Introduction:
1. High speed bright acid copper plating process with advanced formulation.
2. Tolerance to work at higher temperature.
3. Fast plating speed to obtain uniform brightness and leveling on HCD to LCD.
4. Smooth and ductile deposit without pitting or pinholes, can create very good
corrosion resistance with other metals plated on top.
5. Commonly suitable for any size especially polished metal parts.
Operating Parameters
|
Chemical Content |
Working Range |
Optimum |
|
Copper Sulphate |
200 ~ 220 g/L |
210 g/L |
|
Sulphuric Acid |
50 ~ 90 g/L |
75 g/L |
|
Chloride Ion |
80 ~ 120 ppm |
90 ppm |
|
22019 MU Makeup Additive |
6.0 ~ 10 ml/L |
8.0 ml/L |
|
22019 A Brightener |
0.4 ~ 0.6 ml/L |
0.5 ml/L |
|
22019 B Leveler |
0.4 ~ 0.6 ml/L |
0.5 ml/L |
|
Cathode Current Density |
1 ~ 6 A/dm² |
|
|
Anode Current Density |
0.5 ~ 3 A/dm² |
|
|
Temperature |
20 ~ 35 ˚C |
25 ˚C |
|
Agitation |
Vigorous even compressed air agitation |
|
|
Anodes |
Phosphorous copper in titanium baskets with nylon bags |
|
